Metal Bond Diamond Wheels for Silicon Wafers
- 1A1R diamond cut-off for silicon wafers, LED wafers, and SiC
- 1A1 and 6A2 for wafer edge grinding and faces
- Diamond abrasive — not CBN, not for steel
- Made to your diameter, grit, and concentration
Product Information
What we grind
Metal bond wheels grind and cut silicon wafers and related semiconductor work: silicon (Si), LED wafers, sapphire substrates, and silicon carbide (SiC) wafers and blanks. Typical jobs: thin wet cut-off, wafer edge grinding, notch / periphery, and face grinding on thicker blanks.
Metal bond is used here for life and a stable kerf. The rim holds diamond instead of shedding grit the way resin does, so a cut on silicon or a hard sapphire / SiC edge stays consistent through a run. Coolant is normal.
Fused quartz tube and plate belong on Quartz and Ceramics. Architectural glass belongs on Metal Bond × Glass. Carbide tools belong on resin bond.
Cut-off or grinding
Cut-off and grinding use different diamond wheels.
Silicon wafer cut-off (1A1R)
A thin 1A1R is the production diamond cutting wheel for silicon, LED, and many SiC / sapphire blanks. Kerf, runout, and wet cutting matter more than a pretty rim. Metal 1A1R diamond wheels last on a hard, abrasive wafer. Short-run or a very thin kerf can also be electroplated 1A1R.
If the line is a hubbed dicing saw, send flange, OD, thickness, and kerf. We match a metal 1A1R to the spindle.
Wafer edge grinding and faces
Wafer edge grinding and notch / periphery take a 1A1 on the edge. 6A2 when the machine takes a cup on the face of a wafer or a thicker blank. Keep heat in the coolant.
SiC and sapphire wear a metal rim harder than silicon. Send material (Si / SiC / sapphire / GaAs) with the mark.
If the job is a one-off contour, electroplated may fit better.
Shapes
| Shape | Drawing | Role on silicon wafers |
|---|---|---|
| 1A1R |  |
Thin wet cut-off of silicon wafers, LED wafers, SiC and sapphire blanks |
| 1A1 |  |
Peripheral grinding — wafer edge, notch, OD of a blank |
| 6A2 |  |
Cup grinding on faces of wafers and discs |
Also available: 1V1 (narrow grooves). Send the current wheel stamp — we match it.
Send a mark such as 1A1R-125-0.6-22 or 1A1-150-10-22 D76 plus wafer material and wet/dry. We match diameter, thickness, hole, grit, and concentration to the spindle and coolant.
A diamond lapping wheel or lap plate is a different tool from a 1A1R. If you already run a lap, send the plate size and grit.
When metal bond is the wrong wheel
- Architectural glass edge, arris, OG → Metal Bond × Glass
- Fused quartz tube / plate or alumina blanks → Quartz and Ceramics
- Granite, marble, engineered stone → Stone
- Very thin dicing kerf on a hubbed saw → electroplated
- Carbide tools, TCT saws, mold steel → resin bond
- Production grinding of hardened steel → vitrified CBN
Metal bond wheels are wet, diamond, and made for silicon wafers, LED wafers, sapphire, and SiC.
